Customized Semiconductor Wafer Bonder Setup · Optical Inspection Unit With Universal Zoom Head And Tilting Frame
This tender has closed. It is published here as a public record.
- Buyer: Department of Defence Research & Development
- Ministry: Ministry of Defence
- Category: Customized Semiconductor Wafer Bonder Setup,Optical Inspection Unit With Universal Zoom Head And Tilting Frame
- Location: North Delhi, Delhi
- Bid type: bid (goes to reverse auction)
- Published on: 28 Jul 2026
- Closed on: 28 Aug 2026, 04:00 pm IST
About this tender
Customized Semiconductor Wafer Bonder Setup , Optical — total quantity 2. ePBG 5% for 38 months. Delivery to 1 consignee location, 300 days delivery. ±25% option clause on quantity.
Who can bid, EMD and how to apply
- Who can bid: any seller registered on the Government e-Marketplace for Customized Semiconductor Wafer Bonder Setup,Optical Inspection Unit With Universal Zoom Head And Tilting Frame.
- EMD: as declared on GeM.
- Last date: closed on 28 Aug 2026, 04:00 pm IST.
- Where to apply: on GeM (bidplus.gem.gov.in). The bid number, documents and buyer details open with a free iBid.Win account.
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