DESIGN · TAPEOUT · PACKAGING AND TESTING OF CUSTOM ASIC FOR THE IMPLANT UNIT OF COCHLEAR IMPLANT
Open tender on the Government e-Marketplace.
- Buyer: Department of Electronics and Information Technology
- Ministry: Ministry of Electronics and Information Technology
- Category: DESIGN, TAPEOUT, PACKAGING AND TESTING OF CUSTOM ASIC FOR THE IMPLANT UNIT OF COCHLEAR IMPLANT
- Location: Vellayambalam, Kerala
- Delivery location: Thiruvananthapuram
- Bid type: bid
- Published on: 21 Sept 2026
- Closing on: 09 Oct 2026, 06:00 pm IST
About this tender
DESIGN, TAPEOUT, PACKAGING AND TESTING OF CUSTOM — total quantity 1. ePBG 3% for 20 months. Delivery to 1 consignee location, 1 days delivery. MSE relaxations available; ±25% option clause on quantity.
Who can bid, EMD and how to apply
- Who can bid: any seller registered on the Government e-Marketplace for DESIGN, TAPEOUT, PACKAGING AND TESTING OF CUSTOM ASIC FOR THE IMPLANT UNIT OF COCHLEAR IMPLANT.
- EMD: as declared on GeM.
- Last date: bids close on 09 Oct 2026, 06:00 pm IST.
- Where to apply: on GeM (bidplus.gem.gov.in). The bid number, documents and buyer details open with a free iBid.Win account.
Similar live tenders
- Custom Bid for Services - Unstructured Data Collection and Managed Proxy Services,Custom Bid for Services - Supplementary Unstructured Data Collection with Managed Proxy Services,Custom Bid for Services - Structured Data Collection with Managed Proxy Services — Department of Electronics and Information Technology
- Procurement of 63MHz Saw filter — Department of Electronics and Information Technology
- TI AM62A74 OSM - 2GB RAM/16GB eMMC and Wi-Fi & BT (with flashed BSP binary code) — Department of Electronics and Information Technology
- Vulnerability and Penetration Testing - Mobile applications; Application Security Audit (OWASP Top 10), Secure Configuration Review (Devices/OS); Application Security Audit (OWASP Top 10), Vulnerability Addressing — Department of Electronics and Information Technology
- Track-I - SITC and Operationalization of the AI Cloud,Track-II - SITC of DC infra NON-IT in EPC Mode with O and M,Track-II - SICBO of the AI Cloud IT infrastructure,Any other services, allied works etc.,Any other items, component etc. required to complete the solution. — Department of Electronics and Information Technology
Browse live GeM tenders · Guides for bidders · More from Ministry of Electronics and Information Technology · More in Kerala · More DESIGN, TAPEOUT, PACKAGING AND TESTING OF CUSTOM ASIC FOR THE IMPLANT UNIT OF COCHLEAR IMPLANT tenders