Diamond wafering blade for precision saw · 150* 12.7* 0.5 mm · 175* 12.7* 0.6 mm
This tender has closed. It is published here as a public record.
- Buyer: Department of Space
- Category: Diamond wafering blade for precision saw, 150* 12.7* 0.5 mm,Diamond wafering blade for precision saw, 175* 12.7* 0.6 mm
- Location: Thumba, Kerala
- Delivery location: Vikram Sarabhai Space Centre
- Bid type: bid
- Published on: 05 Aug 2026
- Closed on: 26 Aug 2026, 02:00 pm IST
About this tender
Diamond wafering blade for precision saw, 150* 12.7* 0.5 — total quantity 4. Delivery to 1 consignee location, 60 days delivery. MSE relaxations available; ±25% option clause on quantity.
Who can bid, EMD and how to apply
- Who can bid: any seller registered on the Government e-Marketplace for Diamond wafering blade for precision saw, 150* 12.7* 0.5 mm,Diamond wafering blade for precision saw, 175* 12.7* 0.6 mm.
- EMD: as declared on GeM.
- Last date: closed on 26 Aug 2026, 02:00 pm IST.
- Where to apply: on GeM (bidplus.gem.gov.in). The bid number, documents and buyer details open with a free iBid.Win account.
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