H1_NK001109_DE-SOLDERING WIRE · H1_NK001108_SOLDERING PASTE · H1_NK001110_SOLDERING WIRE · H1_NK001469_TEFLON WIRE 1.5MM · Y3_IYC-0839_INSULATION TAPE · H1_NK001332_SILICON TUBE · H1_NK001546_POLYBAGS
This tender has closed. It is published here as a public record.
- Buyer: Department of Military Affairs
- Ministry: Ministry of Defence
- Category: H1_NK001109_DE-SOLDERING WIRE,H1_NK001108_SOLDERING PASTE,H1_NK001110_SOLDERING WIRE,H1_NK001469_TEFLON WIRE 1.5MM,Y3_IYC-0839_INSULATION TAPE,H1_NK001332_SILICON TUBE,H1_NK001546_POLYBAGS FOR PCB BOARD,H1_NK001466_FEVIQUICK,H4_9330-00028_FILM POLYTHENE 0.25MM
- Bid type: bid
- Published on: 11 Jul 2026
- Closed on: 31 Jul 2026, 09:00 am IST
Who can bid, EMD and how to apply
- Who can bid: any seller registered on the Government e-Marketplace for H1_NK001109_DE-SOLDERING WIRE,H1_NK001108_SOLDERING PASTE,H1_NK001110_SOLDERING WIRE,H1_NK001469_TEFLON WIRE 1.5MM,Y3_IYC-0839_INSULATION TAPE,H1_NK001332_SILICON TUBE,H1_NK001546_POLYBAGS FOR PCB BOARD,H1_NK001466_FEVIQUICK,H4_9330-00028_FILM POLYTHENE 0.25MM.
- EMD: as declared on GeM.
- Last date: closed on 31 Jul 2026, 09:00 am IST.
- Where to apply: on GeM (bidplus.gem.gov.in). The bid number, documents and buyer details open with a free iBid.Win account.
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