HEAT SINK FOR ARTIX-7 FPGA · HIGH PERFORMANCE MAXIFLOW WITH THERMAL TAPE ATTACHMENT · HEAT SINK FOR KINTEX-7 FPGA · MAXIFLOW CROSS CUT HIGH PERFORMANCE HEAT SINKS WITH HARDWARE ATTACHMENT

Open tender on the Government e-Marketplace.

• Buyer: Department of Telecommunications (DOT)
• Ministry: Ministry of Communications
• Category: HEAT SINK FOR ARTIX-7 FPGA, HIGH PERFORMANCE MAXIFLOW WITH THERMAL TAPE ATTACHMENT,HEAT SINK FOR ARTIX-7 FPGA, HIGH PERFORMANCE MAXIFLOW WITH THERMAL TAPE ATTACHMENT,HEAT SINK FOR KINTEX-7 FPGA, MAXIFLOW CROSS CUT HIGH PERFORMANCE HEAT SINKS WITH HARDWARE ATTACHMENT,HEAT SINK FOR KINTEX-7 FPGA, MAXIFLOW CROSS CUT HIGH PERFORMANCE HEAT SINKS WITH HARDWARE ATTACHMENT
• Bid type: bid
• Published on: 05 Sept 2026
• Closing on: 26 Sept 2026, 06:00 pm IST

Who can bid, EMD and how to apply

• Who can bid: any seller registered on the Government e-Marketplace for HEAT SINK FOR ARTIX-7 FPGA, HIGH PERFORMANCE MAXIFLOW WITH THERMAL TAPE ATTACHMENT,HEAT SINK FOR ARTIX-7 FPGA, HIGH PERFORMANCE MAXIFLOW WITH THERMAL TAPE ATTACHMENT,HEAT SINK FOR KINTEX-7 FPGA, MAXIFLOW CROSS CUT HIGH PERFORMANCE HEAT SINKS WITH HARDWARE ATTACHMENT,HEAT SINK FOR KINTEX-7 FPGA, MAXIFLOW CROSS CUT HIGH PERFORMANCE HEAT SINKS WITH HARDWARE ATTACHMENT.
• EMD: as declared on GeM.
• Last date: bids close on 26 Sept 2026, 06:00 pm IST.
• Where to apply: on GeM (bidplus.gem.gov.in). The bid number, documents and buyer details open with a free iBid.Win account.

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