Ink Pump System · Ink Sensor · Teflon Sleeve · Pressor Roller · SSD Drive 512 GB · SMPS · OPC Drum · Cleaning Blade · Motherboard H 310 · Processor I3 8th · DVD Writer · Paper few sensor · Upper fuser
Open tender on the Government e-Marketplace.
- Buyer: Department of Military Affairs
- Ministry: Ministry of Defence
- Category: Ink Pump System,Ink Sensor,Teflon Sleeve,Pressor Roller,SSD Drive 512 GB,SMPS,OPC Drum,Cleaning Blade,Motherboard H 310,Processor I3 8th,DVD Writer,Paper few sensor,Upper fuser Roller,Printer Head
- Location: Ambala, Haryana
- Bid type: bid
- Published on: 20 Sept 2026
- Pre-bid meeting: 22 Sept 2026, 09:00 am IST
- Closing on: 10 Oct 2026, 08:00 pm IST
About this tender
Ink Pump System , Ink Sensor , Teflon Sleeve , Pressor — total quantity 26. Delivery to 1 consignee location, 21 days delivery. MSE relaxations available; ±25% option clause on quantity.
Who can bid, EMD and how to apply
- Who can bid: any seller registered on the Government e-Marketplace for Ink Pump System,Ink Sensor,Teflon Sleeve,Pressor Roller,SSD Drive 512 GB,SMPS,OPC Drum,Cleaning Blade,Motherboard H 310,Processor I3 8th,DVD Writer,Paper few sensor,Upper fuser Roller,Printer Head.
- EMD: as declared on GeM.
- Last date: bids close on 10 Oct 2026, 08:00 pm IST.
- Where to apply: on GeM (bidplus.gem.gov.in). The bid number, documents and buyer details open with a free iBid.Win account.
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