Lan Connectors · Lan Wire · Power cable · RAM DDR 3 · Thermal Compound Paste Use in Coolers Heat Sink for CPU and Chip-sets
This tender has closed. It is published here as a public record.
- Buyer: AI Airport Services Limited
- Ministry: Ministry of Civil Aviation
- Category: Lan Connectors,Lan Connectors,Lan Connectors,Lan Connectors,Lan Connectors,Lan Wire,Lan Wire,Lan Wire,Lan Wire,Lan Wire,Power cable,Power cable,Power cable,Power cable,Power cable,RAM DDR 3,RAM DDR 3,RAM DDR 3,RAM DDR 3,RAM DDR 3,Thermal Compound Paste Use in Coolers Heat Sink for CPU and Chip-sets,Thermal Compound Paste Use in Coolers Heat Sink for CPU and Chip-sets,Thermal Compound Paste Use in Coolers Heat Sink for CPU and Chip-sets,Thermal Compound Paste Use in Coolers Heat Sink for CPU and Chip-sets,Thermal Compound Paste Use in Coolers Heat Sink for CPU and Chip-sets
- Bid type: bid
- Published on: 19 Aug 2026
- Closed on: 29 Aug 2026, 05:00 pm IST
Who can bid, EMD and how to apply
- Who can bid: any seller registered on the Government e-Marketplace for Lan Connectors,Lan Connectors,Lan Connectors,Lan Connectors,Lan Connectors,Lan Wire,Lan Wire,Lan Wire,Lan Wire,Lan Wire,Power cable,Power cable,Power cable,Power cable,Power cable,RAM DDR 3,RAM DDR 3,RAM DDR 3,RAM DDR 3,RAM DDR 3,Thermal Compound Paste Use in Coolers Heat Sink for CPU and Chip-sets,Thermal Compound Paste Use in Coolers Heat Sink for CPU and Chip-sets,Thermal Compound Paste Use in Coolers Heat Sink for CPU and Chip-sets,Thermal Compound Paste Use in Coolers Heat Sink for CPU and Chip-sets,Thermal Compound Paste Use in Coolers Heat Sink for CPU and Chip-sets.
- EMD: as declared on GeM.
- Last date: closed on 29 Aug 2026, 05:00 pm IST.
- Where to apply: on GeM (bidplus.gem.gov.in). The bid number, documents and buyer details open with a free iBid.Win account.
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