Semi Automatic Wire Bonder
Open tender on the Government e-Marketplace.
- Buyer: Department of Higher Education
- Ministry: Ministry of Education
- Category: Semi Automatic Wire Bonder
- Location: Khandwa, Madhya Pradesh
- Delivery location: Ugc Dae Consortium For Scientific Research
- Estimated value: ₹80,00,000
- Bid type: bid
- Published on: 09 Oct 2026
- Closing on: 30 Oct 2026, 06:00 pm IST
About this tender
Semi Automatic Wire Bonder — total quantity 1. ePBG 3% for 14 months. Delivery to 1 consignee location. MSE relaxations available; ±25% option clause on quantity.
Who can bid, EMD and how to apply
- Who can bid: any seller registered on the Government e-Marketplace for Semi Automatic Wire Bonder.
- EMD: as declared on GeM.
- Last date: bids close on 30 Oct 2026, 06:00 pm IST.
- Where to apply: on GeM (bidplus.gem.gov.in). The bid number, documents and buyer details open with a free iBid.Win account.
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