Semiautomatic Wedge & Ball Wire Bonder
Open tender on the Government e-Marketplace.
- Buyer: Department of Higher Education
- Ministry: Ministry of Education
- Category: Semiautomatic Wedge & Ball Wire Bonder
- Delivery location: Office Of The Registrar, Iit (bhu), Varanasi - 221005, U.p
- EMD: ₹72,000
- Bid type: bid
- Published on: 05 Oct 2026
- Closing on: 26 Oct 2026, 08:00 pm IST
Who can bid, EMD and how to apply
- Who can bid: any seller registered on the Government e-Marketplace for Semiautomatic Wedge & Ball Wire Bonder.
- EMD: ₹72,000.
- Last date: bids close on 26 Oct 2026, 08:00 pm IST.
- Where to apply: on GeM (bidplus.gem.gov.in). The bid number, documents and buyer details open with a free iBid.Win account.
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