SMPS · RAM · Motherboard · RJ45 Connector · Ink System Assy · Paper Sensor · Taflon Sleeve · Pressure Roller · Paper Pickup Roller · OPC Drum · DC Blade · Paper Pickup Roller assy
Open tender on the Government e-Marketplace.
- Buyer: Department of Military Affairs
- Ministry: Ministry of Defence
- Category: SMPS,RAM,Motherboard,RJ45 Connector,Ink System Assy,Paper Sensor,Taflon Sleeve,Pressure Roller,Paper Pickup Roller,OPC Drum,DC Blade,Paper Pickup Roller assy
- Bid type: bid
- Published on: 01 Oct 2026
- Closing on: 12 Oct 2026, 07:00 pm IST
Who can bid, EMD and how to apply
- Who can bid: any seller registered on the Government e-Marketplace for SMPS,RAM,Motherboard,RJ45 Connector,Ink System Assy,Paper Sensor,Taflon Sleeve,Pressure Roller,Paper Pickup Roller,OPC Drum,DC Blade,Paper Pickup Roller assy.
- EMD: as declared on GeM.
- Last date: bids close on 12 Oct 2026, 07:00 pm IST.
- Where to apply: on GeM (bidplus.gem.gov.in). The bid number, documents and buyer details open with a free iBid.Win account.
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