Thermal Insulation Enclosure Assembly · Precision Front Closure Assembly · Heat Barrier Composite Assembly · Modular Internal Storage Assembly · Secure Access Hardware Assembly
Open tender on the Government e-Marketplace.
- Buyer: Department of Financial Services
- Ministry: Ministry of Finance
- Category: Thermal Insulation Enclosure Assembly,Precision Front Closure Assembly,Heat Barrier Composite Assembly,Modular Internal Storage Assembly,Secure Access Hardware Assembly
- Bid type: bid
- Published on: 30 Oct 2026
- Closing on: 09 Nov 2026, 05:00 pm IST
Who can bid, EMD and how to apply
- Who can bid: any seller registered on the Government e-Marketplace for Thermal Insulation Enclosure Assembly,Precision Front Closure Assembly,Heat Barrier Composite Assembly,Modular Internal Storage Assembly,Secure Access Hardware Assembly.
- EMD: as declared on GeM.
- Last date: bids close on 09 Nov 2026, 05:00 pm IST.
- Where to apply: on GeM (bidplus.gem.gov.in). The bid number, documents and buyer details open with a free iBid.Win account.
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