Wirebond removal for BGA packaged semiconductor chips
This tender has closed. It is published here as a public record.
- Buyer: Department of Electronics and Information Technology
- Ministry: Ministry of Electronics and Information Technology
- Category: Wirebond removal for BGA packaged semiconductor chips
- Location: Vellayambalam, Kerala
- Delivery location: Thiruvananthapuram
- Bid type: bid
- Published on: 19 Aug 2026
- Closed on: 04 Sept 2026, 03:00 pm IST
About this tender
Wirebond removal for BGA packaged semiconductor chips — total quantity 1. Delivery to 1 consignee location, 30 days delivery. MSE relaxations available; ±25% option clause on quantity.
Who can bid, EMD and how to apply
- Who can bid: any seller registered on the Government e-Marketplace for Wirebond removal for BGA packaged semiconductor chips.
- EMD: as declared on GeM.
- Last date: closed on 04 Sept 2026, 03:00 pm IST.
- Where to apply: on GeM (bidplus.gem.gov.in). The bid number, documents and buyer details open with a free iBid.Win account.
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