GeM tenders from Ministry of Electronics and Information Technology in Kerala for Wirebond removal for BGA packaged semiconductor chips

No Government e-Marketplace bids for Wirebond removal for BGA packaged semiconductor chips from Ministry of Electronics and Information Technology in Kerala are open right now. The last one closed on 04 Sept 2026 in Vellayambalam, Kerala. Here is the one on record; new bids appear on this page as soon as GeM publishes them.

Bids on record (1)

1. Wirebond removal for BGA packaged semiconductor chips — Department of Electronics and Information Technology · Kerala · Closed 04 Sept 2026

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