Closed GeM tenders from Ministry of Electronics and Information Technology in Kerala for Wirebond removal for BGA packaged semiconductor chips

228 open now and 1,400 closed on record from Ministry of Electronics and Information Technology. Closed bids, most recently closed first.

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1. Wirebond removal for BGA packaged semiconductor chips — Department of Electronics and Information Technology · Kerala · Closed 04 Sept 2026

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• All in One PC (V2),All in One PC (V2),High End Desktop Computer,High End Desktop Computer,High End Desktop Computer (1)
• Aluminium Rod Dia 6 mm,Aluminium Rod Dia 12 mm,Aluminium Rod Dia 75 mm,Aluminium Rod Dia 80 mm,Aluminium Rod Dia 85 mm,Aluminium Rod Dia 90 mm,Aluminium Rod Dia 95 mm,Aluminium Rod Dia 100 mm,Aluminium Rod Dia 110 mm (1)
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