Closed GeM tenders from Ministry of Electronics and Information Technology for Wirebond removal for BGA packaged semiconductor chips

29 open now and 779 closed on record from Ministry of Electronics and Information Technology. Closed bids, most recently closed first.

1 tenders · page 1 of 1

  1. Wirebond removal for BGA packaged semiconductor chips — Department of Electronics and Information Technology · Closed 04 Sept 2026

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